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Semiconductor device
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#	Item
891	R EADINESS OF 2.5D/3D IC PACKAGE D ESIGN E NVIRONMENT CONFIDENTIAL Copyright © 2014 BroadPak, Corp. All Rights Reserved. BroadPak Corporation Add to Reading List Source URL: www.gsaglobal.org Language: English - Date: 2014-10-23 00:12:40 2.5D Information Copyright law of the United States Copyright Technology Data Semiconductor device fabrication Three-dimensional integrated circuit
892	IP WORKING GROUP MEETING JANUARY 23, 2012 IP Working Group Meeting Agenda  10:30 am Introductions and Overview Add to Reading List Source URL: www.gsaglobal.org Language: English - Date: 2014-01-22 10:44:18 Fairchild Semiconductor Technology Electronic engineering Electronics Hillsboro Oregon Synopsys Multigate device
893	Techniques and Tools for Collaborative Thermal and Mechanical Modeling of 3D Ics Kamal Karimanal Cielution LLC Add to Reading List Source URL: www.gsaglobal.org Language: English - Date: 2014-01-22 10:41:49 Electronics Electronic engineering Industrial engineering Three-dimensional integrated circuit Heat sink Packaging and labeling Technology Integrated circuits Semiconductor device fabrication
894	3D IC ALMANAC 3D IC Almanac Progress Update on 3D IC Roadmap Workgroup  Encountered resistance extracting data from companies regarding their 3D IC readiness and future roadmap. Add to Reading List Source URL: www.gsaglobal.org Language: English - Date: 2014-01-22 10:41:21 Three-dimensional integrated circuit Technology Integrated circuits Semiconductor device fabrication Almanac
895	Next Generation Stacked Memory Systems Alok Gupta NVIDIA, Santa Clara, CA 1 Add to Reading List Source URL: www.gsaglobal.org Language: English - Date: 2015-01-23 15:54:47 Dynamic random-access memory Electronic engineering Interposer Semiconductor device fabrication Technology Through-silicon via Computer memory Integrated circuits Electronics
896	Microsoft PowerPoint - Standards Related to 3D Packaging (Jasbir Bath, IPC) [Compatibility Mode] Add to Reading List Source URL: www.gsaglobal.org Language: English - Date: 2014-02-04 09:46:57 Electronics Three-dimensional integrated circuit Wafer Packaging and labeling Integrated circuit packaging Through-silicon via Semiconductor device fabrication Technology Microtechnology
897	3D IC WORKING GROUP MEETING JULY 17, 2013 3D IC Working Group Meeting Agenda  2:00 pm Add to Reading List Source URL: www.gsaglobal.org Language: English - Date: 2014-01-22 10:41:26 Electronic engineering Computer memory Technology Fabless semiconductor companies Three-dimensional integrated circuit Back end of line Rambus Dynamic random-access memory Interposer Semiconductor device fabrication Electronics Integrated circuits
898	Technology Steering Committee Dr. Naveed Sherwani, Chairman August 8th, 2012 Agenda Add to Reading List Source URL: www.gsaglobal.org Language: English - Date: 2014-01-22 10:47:41 Microtechnology Three-dimensional integrated circuit Wafer Fabless semiconductor company Microelectromechanical systems Semiconductor Equipment and Materials International Multigate device Global Semiconductor Alliance Semiconductor device fabrication Technology Materials science
899	3D IC integration and ESD: “Not the ESD you grew up with!” Stephen Fairbanks Managing Director Add to Reading List Source URL: www.gsaglobal.org Language: English - Date: 2014-01-22 10:41:25 Physics Electricity Electrical safety Electrical breakdown Electrostatics Electrostatic discharge Three-dimensional integrated circuit Through-silicon via Wafer backgrinding Electromagnetism Semiconductor device fabrication Integrated circuits
900	Load Correction Device 31LCDA S31LCDA Installation Instructions Add to Reading List Source URL: www.laser.com Language: English - Date: 2015-01-15 12:43:00 Light-emitting diodes Semiconductor devices Electromagnetism Dimmer LED lamp Phase fired controllers Lighting Stage lighting Light

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